MATERIAL
Thermal Interface Material
About
MAMTIM is a critical intermediate product for Turkey's strategic sectors such as electronics, defense and aerospace. This THS 5 level technology is an important step towards reducing dependence on imported products in the field of thermal management materials and strengthening the domestic technology ecosystem. The maturation and mass production of the technology has the potential to increase the competitiveness of domestic electronics production.
Product Overview
It is a high-performance polymer nanocomposite material that maximizes heat transfer by filling microscopic gaps between heated components (processor, power transistor, etc.) and coolers in electronic and microelectronic systems. This prevents devices from overheating and increases their performance and lifespan.
Product Name
Thermal Interface Material
Product Short/Code Name
MAMTIM
Product Type
Final Product (Technology Demonstration / Prototype Level)
Developer Research Groups
Materials and Process Technologies BY - Chemical Process Technologies AG
Production and Technology Status
Technology Readiness Level (THS)
THS 5
Current Status
It can be actively produced as a prototype.
Production Capacity
200×100 mm plate per month. This capacity is suitable for current technology validation and prototype development.
Technical Capabilities and Capacity
MAMTIM answers a fundamental need of modern electronics by combining thermal conduction and electrical insulation.
Working Principle
MAMTIM, which is applied between the heat-generating chip and the heat sink metal, conducts heat efficiently while preventing possible short circuits with its electrically insulating structure.
Key Technical Specifications
Thermal Conductivity: 0.8 - 1.2 W/mK. This value is sufficient for efficient heat transfer in many electronic applications.
Electrical Insulation: The very high surface resistivity of approx. 10¹⁶ ohm.cm makes the material an excellent electrical insulator and ensures safe use.
Nanocomposite Structure: The thermal performance of the material is enhanced thanks to nanosheets smaller than 10 nm dispersed in a thermoplastic polymer matrix.
High Interface Compatibility: It maximizes heat transfer efficiency by spreading perfectly on the applied surfaces.
- Power Electronics: Power supplies, inverters, industrial control units.
- Consumer Electronics: LED lighting systems, LCD televisions, computers, game consoles.
- Telecommunications: Wireless communication devices, base stations, network equipment.
- Defense and Aviation: Avionics, radar units and other military systems where thermal management is vital.