TÜBİTAK MAM Institute of Chemical Technology (KTE) is developing a new generation of polymer nanocomposites with high thermal conductivity and low electrical resistance to solve thermal management problems in the field of electronics/microelectronics.

Thermal interface materials are materials with high thermal conductivity suitable for rough mating surfaces and are used in the form of grease, phase change materials, adhesives and thermal films. The developed thermally conductive nanocomposites can be used as components of electronic/microelectronic materials such as heat sinks, polymer-based electronic circuits, cooling systems, LED bulbs, etc. Thermoplastic matrix thermal conductive nanocomposites are in the new generation material class in the world market and are starting to take their place in the product ranges of world giant companies.

Boron Nitride Thermal Interface Material with high interface compatibility, low surface resistance of 2.0-4.5 x 1014 ohm.cm and 3-10 nm nanoparticle thickness can be used in power units, cooling systems, thermal management systems, LCD TVs, wireless devices, LEDs, telecommunication devices.