TÜBİTAK MAM Institute of Chemical Technology has been developing a production technology for new generation polymer nanocomposites with high thermal conductivity and low electrical resistance for solving thermal management problems in the field of electronics/microelectronics.
Thermal interface materials are high thermal conductivity materials that are suitable for rough joining surfaces and used in the form of grease, phase change materials, adhesives and thermal films. The developed thermally conductive nanocomposites can be used as electronic/microelectronic components in heat sinks, polymer-based electronic circuits, cooling systems, LED lamps, etc. Thermally conductive nanocomposites with thermoplastic matrices are new generation materials in the world market; and they have started to take place in the product ranges of the world’s giant companies.
The Thermal Interface Material containing Boron Nitride with high interface compatibility, low surface resistance of 2.0-4.5 x 1014 ohm.cm and nanolayer thickness of 3-10 nm can be used in power units, cooling systems, thermal management systems, LCD TVs, wireless devices, LEDs and telecommunication devices.
